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倒装语序的英文

发音:   用"倒装语序"造句
  • inverted word-order
  • 倒装:    upside down mounting; upside ...
  • 语序:    word order
  • 句子用倒装语序:    note: no sooner …than
  • 语序:    [语言学] word order
  • 倒装:    upside down mounting (集成电路组装的); upside-down charging◇倒装词序 [语言学] inverted word order; 倒装法 upside-down mounting; flip-chip; [语言学] anastrophe; 倒装句 [语言学] inverted sentence; 倒装小齿轮 contravane
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例句与用法

  1. Against this is set off notional rate of interest
    此句为倒装语序

相关词汇

        倒装:    upside down mounting; upside ...
        语序:    word order
        句子用倒装语序:    note: no sooner …than
        语序:    [语言学] word order
        倒装:    upside down mounting (集成电路组装的); upside-down charging◇倒装词序 [语言学] inverted word order; 倒装法 upside-down mounting; flip-chip; [语言学] anastrophe; 倒装句 [语言学] inverted sentence; 倒装小齿轮 contravane
        词语序列:    sequence of words
        调整语序:    translation inversion
        自然语序:    natural word-order
        倒装法:    anastrophen; flip chip approach; flip chip method; flip-chip; hyperbaton; u ide-down method of hull section co truction; up-side-down mounting; upside-down method of hull section construction
        倒装焊:    fcb flichibonding
        倒装句:    inversion; inverted sentence
        倒装模:    inverted mold; inverted mould
        倒装片:    flip-chip
        倒装式:    flitab
        倒装置:    focusing device; focusing mechanism
        板上倒装片:    fcob flichion board
        倒装词序:    inverted word order
        倒装法的:    hyperbatic
        倒装法地:    hyperbatically
        倒装否定:    inverting negative
        倒装焊接:    face down bonding; flip chip bonding
        倒装焊接法:    flip-chip method
        倒装焊接机:    face down bonder; face-down bonder
        倒装焊接器:    flip-chip bonder
        倒装简述:    set about doing

相邻词汇

  1. "倒装芯片集成电路"英文
  2. "倒装芯片隆起焊盘"英文
  3. "倒装芯片贴装"英文
  4. "倒装芯片贴装，倒装芯片附着"英文
  5. "倒装芯片座"英文
  6. "倒装置"英文
  7. "倒装肘板"英文
  8. "倒装辘轳"英文
  9. "倒撞"英文
  10. "倒状"英文
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