固态组件的英文

• solid-state module

• 固态    solid state; solid phase; so ...
• 固态组体    solid-state component
• 动态组件    dynamic assembly
• 固态    [物理学] (物质的固体状态) solid state; solid phase; solidity 牛乳中的固态物质包括盐分、蛋白质和糖。 milk solids include salts, protein and sugar.; 固态激光器 solid-state laser; 固态键盘 solid state keyboard; 固态降水 solid precipitation
• 动态组    dynamic set
• 模态组    modal class
• 组件    assembler; assembly group; assembly parts; cluster unit; component entities; component; module; components; componet; discreteness; element; groupware; kit; member; modulo; modulus; nc assembly; o.e.m. parts; package; subassembly; subgroup; trim; unit
• 波痕形态组    ripple form-set; ripple-form set
• 动态组合块    dynamic pool block
• 动态组织    dynamic organization
• 动态组组号    dynamic grounumber
• 基本模态组    fundamental mode group
• 生态组合    ecologic assemblage; environmental association
• 生态组合带    ecozone
• 生态组合区    biotic province
• 生态组织    ecological organisation; ecological organization
• 文件状态组    document status group
• 形态组构    formal fabric; formalfabric; shape fabric
• 行动状态组    action state pairs
• 溢出状态组    overflow status set
• 铸态组织    as cast structure; cast microstructure; casting-state structure
• 动态组号分配    dynamic grounumber assignment
• 形态组构要素    dimensional fabric element
• 半固态    semisolid state
• 超固态    ultra-solid

• Solid state components not relied upon to reduce the risk of electric shock and that may be damaged by the applied dielectric potential may be disconnected for the test
  不可能用来减少电击风险或有可能被所加的绝缘测试电压损伤的固态组件可以为测试而断开连接。
• The circuitry may be rearranged for the purpose of the test to reduce the likelihood of solid state component damage while retaining the representative dielectric stress on the circuit
  电路上某段出现尖峰电压时，为了测试，可以将电路重新安排，以减少固态组件受损的可能性。
• The circuitry may be rearranged for the purpose of the test to reduce the likelihood of solid state component damage while retaining the representative dielectric stress on the circuit
  有获得的电介质应力集中在电路时，为了测试，可以将电路重新安排，以减少固态组件受损的可能性。
• ( 2 ) thermal resistance model and cfd are used for thermal design of some air - cooled solid - state module . among these thermal resistances , convective and spreading resistances are emphasized
  ( 2 )针对某风冷固态组件的散热需求,利用热阻模型和流体计算动力学( cfd )数值模拟技术分析和设计了散热器。
• ( 4 ) after the rationality of numerical simulation has been testified , going along a series of numerical simulation and performance research . firstly , the thermal superposition principle , based on adiabatic heat transfer coefficient and superposition kernel function , is put forward for the research of discrete heat sources ’ temperature field and thermal conjunction effects secondly , decreasing thermal spreading resistance is good for improving the heat transfer performance , and several methods are discussed
  第一、在热叠加原则理论基础上,利用数值模拟方法研究了固态组件的温度场和多个分散热源在热扩展体上的热耦合效应,而且证明了强迫对流情况下热叠加原理形成的温度场和系统模拟时的温度场计算结果非常吻合;第二、针对固态组件里集中热源的特点,对扩展热阻进行了研究,从理论上探讨了减小扩展热阻改善散热性能的方法。
• To meet the demand of thermal dispersion of some solid - state module , system research for thermal techniques is carried out , and the main contents are as follows … ( 1 ) the solid - state modules and interrelated thermal techniques are introduced on research background , and moreover developing tendencies of electronics cooling are described
  本文对某雷达发射固态组件的热技术进行了系统的研究,主要内容包括: ( 1 )对固态组件散热技术的研究背景和意义进行了阐述,对电子散热技术的现状和发展趋势进行了总结。

• 固态组件的法语：composant à l'état solide